SV Thermal Conductive Two Component 1:1 electronic potting compound Sealant for Junction Box
Mafotokozedwe Akatundu

MAWONEKEDWE
1. Low mamasukidwe akayendedwe, fluidity zabwino, kudya kuwira kutha.
2. Kusungunula kwabwino kwamagetsi ndi kutentha kwa conduction.
3. Ikhoza kukhala yozama kwambiri popanda kutulutsa zinthu zochepa za maselo panthawi yochiritsa, imakhala ndi kuchepa kwakukulu komanso kumamatira kwambiri ku zigawo zikuluzikulu.
KUPAKA
A:B =1:1
Kulemera kwake: 25kg
B gawo: 25KG
ZOYENERA KUGWIRITSA NTCHITO
1. Potching ndi madzi kwa dalaivala wa LED, ma ballast, ndi masensa oyimitsa magalimoto.
2. Insulation, conduction thermal conduction, chinyezi-proofing, ndi kukonza ntchito kwa zipangizo zina zamagetsi
ZINTHU ZONSE
Miyezo iyi sinapangidwe kuti igwiritsidwe ntchito pokonzekera zofunikira
THUPI | A | B | |
Pamaso Osakaniza | Maonekedwe | Choyera | Wakuda |
(25 ℃, 65% RH) | Viscosity | 2500±500 | 2500±500 |
Kachulukidwe (25 ℃, g/cm³) | 1.6±0.05 | 1.6±0.05 | |
Pambuyo Kusakaniza | Chigawo (Mwa kulemera kwake) | 1 | 1 |
(25 ℃, 65% RH) | Mtundu | Imvi | |
Viscosity | 2500 ~ 3500 | ||
Nthawi Yogwirira Ntchito (mphindi) | 40-60 | ||
Nthawi Yochiritsa (H, 25 ℃) | 3~4 | ||
Nthawi Yochiritsa (H, 80 ℃) | 10-15 | ||
Pambuyo Kuchiritsa | Kulimba (Shore A) | 55 ±5 | |
(25 ℃, 65% RH) | Tensile Strength (Mpa) | ≥1.0 | |
Thermal Conductivity (W/m·k) | ≥0.6~0.8 | ||
Mphamvu ya Dielectric (KV/mm) | ≥14 | ||
Dielectric Constant (1.2MHz) | 2.8-3.3 | ||
Kukaniza kwa Voliyumu (Ω·cm) | ≥1.0×1015 | ||
Coefficient of Linear Expansion (m/m·k) | ≤2.2 × 10-4 | ||
Kutentha kogwira ntchito (℃) | -40-100 |
Lembani uthenga wanu apa ndikutumiza kwa ife